3D-Lead-Inspection

For an accurate programmed device processing (e.g. during soldering) it is essential to make sure that no leads are damaged or deformed. However, lead deformations cannot be completely excluded because of the device contacting during the programming process. Moreover, the existence of a potential damage at delivery should also be taken into consideration. For this reason, a final lead inspection is vital. Instead of using a two-dimensional measurement, we apply a highly sophisticated 3D-camera system which recognises all kinds of pin deformation thus ensuring coplanarity. In addition, an Automatic Optical Inspection (AOI) system controls the marking as well as the device position and guarantees efficient further processing.

• Automated 3D-Lead-Inspection und Mark Inspection

• Inspection of all current types of packages
(e.g. Gullwing Pins, J-Lead Pins, BGAs)

• Fully automated pick and place of devices

• Defined placement of fails

• No pin fails any longer