After a very complex opening process an insightful analysis of causes can be generated with subsequent examinations per light microscopy or scanning electron microscopy.

Decapsulation 1 ESD/EOS damage Decapsulation 2 Decapsulation 3

Possible applications:

  • Detection of overloads
  • Determination of manufacturer (authenticity)
  • Examination of bond areas, micro-cracks, structure failures

Decapsulation

In cases where a direct examination of chip surfaces is necessary, e.g. to detect the exact version of the used chip or its manufacturer, an opening of the electronic component can be important. The opening process is very complex and requires a special know-how, grown at our facilities over years. The procedures must be tailored exactly to the component material to avoid unwanted internal damages.

With subsequent examinations per light microscopy or scanning electron microscopy we generate an insightful analysis of causes resulting from potential ESD and EOS damage of the component, excessive currents, mechanical stress or similar effects.