The high-precision HTV-equipment works with a three-dimensional method recognizing all kinds of pin deformation and ensuring coplanarity.

3D-Lead inspection 3D-Lead inspection

3D-lead inspection

The steadily increasing requirements (0-ppm) regarding process stability make it indispensable that components adhere to mechanical dimensions according to their datasheet. Thus, it is of vital importance for a trouble-free subsequent processing (e.g. at soldering) of programmed components that the component pins are not damaged.

Deformation of pins at contacting during the programming operation cannot be eliminated completely. Even on delivery a damage might already be present. All the more it is important to perform a subsequent 3Dlead inspection, at which all pins are measured via a camera-system.

In contrast to the most inspection-systems, measuring is only two-dimensionally performed, the high-precision HTV-equipment works with a three-dimensional method recognizing all kinds of pin deformation and ensuring coplanarity.

Besides, marking and positioning of the components is inspected via Automatic Optical Inspection (AOI). Hence, a trouble-free processing is ensured to the customer.