HTV offers a comprehensive service spectrum for testing, packaging and qualifying your electronic semiconductor circuits.

Packacking Wafer sawing

At a glance:

Services of MAF GmbH

  • Wafer-sawing
  • Manufacturing of samples in ceramic packages
  • Premold packages
  • Chips in waffle-pack
  • Packaging of series quantities

Services of MAF GmbH

Packaging

A close cooperation between MAF GmbH in Frankfurt/Oder and Halbleiter-Test & Vertriebs-GmbH opens up a definitely improved possibility for packaging respectively housing of integrated circuits in the middle of Europe, opposite to Far Eastern suppliers. Direct, open ways of communication and contact persons, definite shorter processing times as well as a trouble-free logistics supply chain interconnect to a universal center of excellence on highest, certificated standard.

Wafer sawing

Wafer sawing and waffle packing belong to the offered services of MAF GmbH. Currently, developments of additional packaging types and the integration of all the Design-to-Test-Processes of Halbleiter-Test & Vertriebs-GmbH are the objectives for a prospective comprehensive service spectrum for testing, packaging and qualifying your electronic semiconductor circuits.