Via the revivec®-Reconditioning Method the solderability, specifically of older parts, can be revived.
- Reviving solderability
- Cleaning and reconditioning of oxidized or corroded surfaces
- Removal of inorganic and organic impurities
revivec® - Cleaning and Reconditioning of electronic components
The revivec®-Reconditioning Method, especially developed at HTV for electronic components, enables the removal of organic and inorganic effects in form of oxide layers, corrosive areas and diverse impurities at component pins.
On the basis of material-specific and to the respective oxidation level adjusted compositions the relevant areas are cleaned, evaluated and finally regenerated in an ambitious process. Based on this particular know-how, especially generated in our facilities, the solderability, specifically of older parts, can be revived.
The procedure is also appropriate to printed circuit boards, lead frames or mechanical components and is then adjusted to these requirements.