Evaluation of a PCB

Examination of the quality of bare printed circuit boards and assemblies according to IPC-A-600 and IPC-A-610

Applied standards

  • IPC-A-600
  • IPC-A-610
  • IPC-TM-650
  • J-STD-001
  • J-STD-003
  • DIN EN 60068-2-69
  • DIN EN ISO 3497

At HTV, assemblies and bare printed circuit boards are comprehensively and highly precisely inspected using a variety of processes and methods according to IPC-A-600 and IPC-A-610.

Via with damaged solder resist mask on top of printed circuit board
Microsection of a via
Measurement of the solder mask thickness in dark field

Investigations according to IPC-A-600

The generally accepted IPC-A-600 standard contains speci-fications concerning the evaluation of the condition of bare printed circuit boards to ensure error-free and reliable assemblies, devices and systems.

At the HTV Institute for material analysis bare printed circuit boards are investigated by certified IPC specialists using numerous analytical methods in view of the following features:ahren hinsichtlich folgender Merkmale untersucht:

Externally visible features:

  • Base material surface
  • Holes and contacts
  • Conductive pattern
  • Solder resist (solder mask)
  • Solder coatings
  • Marking

Internal features (microsection):

  • Registration of the conductor and hole pattern
  • Evaluation of the conductive pattern and the base material with etching characteristics,
    conductor thickness, foil thickness, layer-to-layer spacing, electrical spacing, blind vias and buried vias, burrs and nailheading, plating thickness, annular ring, solder resist thickness, roughness, nodules, flares
  • Characterization of defects in the laminate
    (outside the heat zone), such as delamination/
    bubble formation, separation of internal layers, cracks in plating and foils, etchback, lifting of
    lands, incomplete plating (holes)
  • Acceptance criteria for flexible and rigid-flexible printed circuit boards, metal core printed circuit boards
  • Measurement of ionic contamination
  • Solderability test

Displaced component
Contaminated pins
Solder fill incomplete

Investigations according to IPC-A-610

The IPC-A-610 standard forms the basis for the visual non-destructive assembly examination.
In the HTV Institute for material analysis certified IPC specialists evaluate the quality of assemblies using various criteria:

  • Mounting and securing parts:
    Installation of mounting parts, connectors, handles, extractors
  • Solder joints:
    Acceptance requirements, anomalies
  • Terminal connections:
    Edge clips, swaged hardware, wire/lead placement, insulation, soldering terminals – solder
  • Through hole technology:
    Component mounting, component securing, supported/unsupported holes
  • Printed circuit boards and assemblies:
    Laminate requirements, marking, coating
  • Discrete wiring:
    Solderless wrap technology, jumper wires, cable preparation for strain/stress relief on connectors

A detailed IPC-A-600/610 investigation report comprehensively presents the current condition of the printed circuit board or assembly with informative image documentation.

Info box:
In the HTV Academy specific knowledge about the IPC-A-600/610 standard can be acquired. In addition, a further education to become an official IPC certified IPC-A-600/610 specialists (CIS) are possible.