HTV-TAB®-Long-term conservation and storage of wafers and DIEs
- Ensuring the quality, processability and functionality for up to 50 years through immense reduction of aging processes
- Clean Room handling and processing
- Cyclic pull and shear test to check the bondability of the pads of bare DIEs
- Microscopic inspection of bare DIEs, checking for impurities, cracks or colour changes
The TAB®-Long-Term Conservation Method is of decisive importance for wafers and bare DIEs to ensure long-term processability and functionality as well. Due to the drastic reduction of aging mechanisms such as the migration of atoms at chip level (diffusion processes), which can lead to leakage currents and thus to considerable malfunctions, it is possible to store wafers and DIEs for up to 50 years without significant quality losses, depending on the initial condition.
Handling and optional further processing of the goods (e.g. wafer dicing, bonding and packaging) in a clean room to prevent contamination, if required, offers the highest quality standards throughout the entire storage process. In addition, the bonding capability of the pads can be documented by a cyclic pull and shear test of bare DIEs. An optical inspection, even of wafers if so required by the customer, enables the clear identification of contaminations, cracks or discoloration.
