Electrical Testing

Ensuring the electrical functionality of components and assemblies

Applied standards

  • AS6081

Possible applications:

  • Testing of components according to datasheet or customer specifications
  • Electrical testing of assemblies (i.e., servers, sensors, displays)
  • Selection of components according to customer-specific electrical parameters (even in series quantities)
  • Testing substitutes and equivalents of an alternate manufacturer using comparative electrical tests
  • Wafer testing
  • Function testing of electronic components under high voltage, high current or high frequency conditions
  • Function testing and authentication of components
  • In-house development of test programs

Using a multitude of highly complex mixed-signal testing systems, programs and applications specifically developed for the tests required by the customer, HTV is able to ensure the electrical functionality of all kinds of electronic components as well as entire assemblies (digitally, analogous, or mixed signal).

Component testing according to datasheet or customer specifications

Testing components according to a datasheet, for example during an inspection of received goods, happens under varying parameters, even extreme differences in temperature (standard, high or ultra-low temperatures, from -60°C up to +150°C).

This can also be used to evaluate not only the electrical properties of components, but also their measurements, their structure as well as their general condition, if necessary. Component testing according to customer specifications is very important for special applications which frequently use components which in turn exceed the specifications guaranteed by the manufacturer. Various tests ensure that these analogue and digital components comply with clearly defined customer specific limits (temperature, voltage, electrical specifications).

Electrical testing under the Thermostream

Thanks to various measuring and testing systems as well as distinct special installations it is possible to not only comprehensively test individual components (e.g. ICs, ASICs, transistors, operational amplifiers) but complex sensors, actuators, displays and entire assemblies as well.

Component testing according to a datasheet is of vital importance for components of a rather dubious origin, for this allows an initial authentication of components without necessitating further and deeper methods of analyis (e.g. x-raying, swab testing).

The blank check is another method to authenticate components as well as testing their general functionality. Among other things this can verify whether the component contains an IC or not, if the circuit’s ID-number is correct or even if the component has been programmed in the past.
Testing via programming verifies a component by programming a test sample. This makes it possible to tell the extent of the component’s responsiveness and whether every memory location can be written and erased without errors.

Selection of components according to customer specifications

Selection allows sorting components according to distinct, customer-specific electrical parameters. The components are assigned to individual selection classes defined by specific parameter areas. For example, LEDs of different color temperatures can be sorted into individual classes, which prevents the development of visible color or brightness deviations.

Wafer testing

Several handling and contact systems can test components which are still installed on wafers (even under temperature exposure) to recognize a defective die early on. The failed components are either color inked or marked on an electronic wafer map to enable sorting them out after the wafer has been diced.

Wafer testing
Electronical wafer map