Light microscopy

Light microscopy as analysis and documentation method

Possible applications:

  • Analysis of printed circuit boards and assemblies
  • Surface examination of contact pins of electronic components
  • Investigation regarding occurrence of oxidation and diffusion effects
  • Measurement of layer thicknesses and layer structures
  • Documentation of deformation, damages and cracks at electronic components
  • Examination of solder joints

For the documentation of damaged components and for the examination of solder joints or already prepared samples, e.g. microsections, the light microscopy is an essential and important analysis method.

Depending on the problem and the size of the samples a variety of modern high-resolution microscopes with several configuration options are available to achieve optimum analysis results, e.g. reflected and transmitted light as well as dark field inspection methods.

Images are digitized by use of high-resolution cameras and are standardly provided in a complete examination report. Due to special image processing tools identified problem areas can be clearly highlighted and marked.

The light microscopy is an essential method, for example, to inspect printed circuit boards according to IPC-A-610.

Oxidized coating of a through hole
Micrograph of a through hole
package end of a pin with cracked coating

Examples for damaged electronic components

Excess Solder Bridging (soldered connection between terminals that should not be connected)
Crack in the swaged area of the PCB