TÜV NORD GROUP
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ASIC Design and Testing
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MTBF Calculation
Testing Optical Parameters
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OTP-Alive
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HTV-TAB®- Long-term conservation
HTV-TAB®- Long-term conservation of assemblies
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HTV-TAB®- Long-term conservation in high-security buildings
Material changes and aging processes
Obsolescence management
Relifing of space components
HTV-EverStock
HTV-PermaDoc®
Material Analysis Institute
Material Testing
Additive Manufacturing
PFAS Substitute Qualification
Accredited test laboratory
Chemical component decapsulation
Dye & Pull Test
Uncovering component counterfeiting
Infrared Spectroscopy (FTIR)
Evaluating printed circuit boards
Light microscopy
MetaFinePrep®
Nanoindentation
Quality control of welding seams
SEM/EDX Analysis
X-ray fluorescence analysis (XRF)
X-ray inspection
Microsectioning and Ion beam etching
Ultrasonic-Microscopy (SAM)
Fully automated solderability test
Component Processing
3D lead inspection
Component drying
Tape & Reel Service
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Reballing
Reworking printed circuit boards
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db-creator – individual process digititalization
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Tag Archive: ACCRETECH UF2000
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About us
▽
Group of companies
Services
▽
Test House
▽
ASIC Design and Testing
Testing Assemblies
Electrical Testing
MTBF Calculation
Testing Optical Parameters
Memory Qualification
Environmental Testing and Qualification
Programming
▽
Component Programming
OTP-Alive
Long-Term Conservation
▽
HTV-TAB®- Long-term conservation
HTV-TAB®- Long-term conservation of assemblies
HTV-TAB®- Long-term conservation of displays
HTV-TAB®- Long-term conservation of wafers & DIEs
HTV-TAB®- Long-term conservation in high-security buildings
Material changes and aging processes
Obsolescence management
Relifing of space components
HTV-EverStock
HTV-PermaDoc®
Material Analysis Institute
▽
Material Testing
▽
Additive Manufacturing
PFAS Substitute Qualification
Accredited test laboratory
Chemical component decapsulation
Dye & Pull Test
Uncovering component counterfeiting
Infrared Spectroscopy (FTIR)
Evaluating printed circuit boards
Light microscopy
MetaFinePrep®
Nanoindentation
Quality control of welding seams
SEM/EDX Analysis
X-ray fluorescence analysis (XRF)
X-ray inspection
Microsectioning and Ion beam etching
Ultrasonic-Microscopy (SAM)
Fully automated solderability test
Component Processing
▽
3D lead inspection
Component drying
Tape & Reel Service
Marking procedures
Component Conditioning
Reballing
Reworking printed circuit boards
Research projects
db-creator – individual process digititalization
News/Events
HTV-Academy
Contact
▽
Newsletter
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