Quality and failure analysis of assembled PCBs or modules

Analyse von Baugruppen und Leiterplatten 1 Analyse von Baugruppen und Leiterplatten 2

Analysis of components and circuit boards

Evaluation of manufacturing quality of modules is not only important prior to a long-term conservation. Respective examinations for process control are indispensable, both, during production and within the scope of failure analyses!

Due to versatile, ultramodern analysis possibilities failure potential is ascertained at an early stage and appropriate corrections can be implemented as soon as possible. Examinations are individually aligned together with the customer or performed on the basis of common standards (e.g. IPC-A-610 and IPC-A-600). The evaluations of PCBs according IPC-A-600 respectively assamblies according to IPC-A-610 are carried out by IPC certified specalists. Those are supervised and frequently instructed by our in-house IPC certified trainers.

A detailed examination report together with expressive image documentation describes the current state of modules or assembled PCBs.

Additionally to the visual evaluation of PCBs or electronic assemblies the measurement of ionic contamination accoring to established standards like:

  • MIL-P-28809
  • MIL-STD-2000A
  • DEF-STD 10/03
  • IPC-TR-583
  • IPC-TM-650 Methode 2.3.25
  • IEC Standards

can be conducted.