Logo
  • TÜV NORD GROUP
  • Digital & Semiconductor
  • Deutsch

YOUR Service Center
for electronic components

  • About us
    • Group of companies
  • Services
    • Test House
      • ASIC Design and Testing
      • Testing Assemblies
      • Electrical Testing
      • MTBF Calculation
      • Testing Optical Parameters
      • Memory Qualification
      • Environmental Testing and Qualification
    • Programming
      • Component Programming
      • OTP-Alive
    • Long-Term Conservation
      • HTV-TAB®- Long-term conservation
      • HTV-TAB®- Long-term conservation of assemblies
      • HTV-TAB®- Long-term conservation of displays
      • HTV-TAB®- Long-term conservation of wafers & DIEs
      • HTV-TAB®- Long-term conservation in high-security buildings
      • Material changes and aging processes
      • Obsolescence management
      • Relifing of space components
      • HTV-EverStock
      • HTV-PermaDoc®
    • Material Analysis Institute
      • Material Testing
        • Additive Manufacturing
        • PFAS Substitute Qualification
      • Accredited test laboratory
      • Chemical component decapsulation
      • Dye & Pull Test
      • Uncovering component counterfeiting
      • Infrared Spectroscopy (FTIR)
      • Evaluating printed circuit boards
      • Light microscopy
      • MetaFinePrep®
      • Nanoindentation
      • Quality control of welding seams
      • SEM/EDX Analysis
      • X-ray fluorescence analysis (XRF)
      • X-ray inspection
      • Microsectioning and Ion beam etching
      • Ultrasonic-Microscopy (SAM)
      • Fully automated solderability test
    • Component Processing
      • 3D lead inspection
      • Component drying
      • Tape & Reel Service
      • Marking procedures
      • Component Conditioning
      • Reballing
      • Reworking printed circuit boards
    • Research projects
    • db-creator – individual process digititalization
  • News/Events
  • HTV-Academy
  • Contact
    • Newsletter
News / Events / Publications » Technical publications » Long-term storage of wafers. As fresh as on the first day after 30 years.

Long-term storage of wafers. As fresh as on the first day after 30 years.

10. September 2024

Newsübersicht weitere Fachbeiträge Nachrichten TV-Beiträge

Address

HTV Halbleiter-Test & Vertriebs-GmbH
HTV Conservation GmbH
Robert-Bosch-Str. 28
D-64625 Bensheim
Phone: +49 (0) 62 51 / 8 48 00-0
Fax: +49 (0) 62 51 / 8 48 00-30
E-mail: info@htv-gmbh.de
Internet: www.htv-gmbh.de
© HTV All rights reserved

Partner

HTV-membership


HTV Newsletter

Subscribe
HTV Newsletter

Check your inbox or spam folder to confirm your subscription.

Social Networks

Social Media Profile - Join now and connect

  • Instagram
  • LinkedIn
  • YouTube

Inspired by Knowledge

TUEV Nord Group Logo
  • Contact
  • Legal notice
  • GTC
  • Privacy policy
  • About us
    ▽
    • Group of companies
  • Services
    ▽
    • Test House
      ▽
      • ASIC Design and Testing
      • Testing Assemblies
      • Electrical Testing
      • MTBF Calculation
      • Testing Optical Parameters
      • Memory Qualification
      • Environmental Testing and Qualification
    • Programming
      ▽
      • Component Programming
      • OTP-Alive
    • Long-Term Conservation
      ▽
      • HTV-TAB®- Long-term conservation
      • HTV-TAB®- Long-term conservation of assemblies
      • HTV-TAB®- Long-term conservation of displays
      • HTV-TAB®- Long-term conservation of wafers & DIEs
      • HTV-TAB®- Long-term conservation in high-security buildings
      • Material changes and aging processes
      • Obsolescence management
      • Relifing of space components
      • HTV-EverStock
      • HTV-PermaDoc®
    • Material Analysis Institute
      ▽
      • Material Testing
        ▽
        • Additive Manufacturing
        • PFAS Substitute Qualification
      • Accredited test laboratory
      • Chemical component decapsulation
      • Dye & Pull Test
      • Uncovering component counterfeiting
      • Infrared Spectroscopy (FTIR)
      • Evaluating printed circuit boards
      • Light microscopy
      • MetaFinePrep®
      • Nanoindentation
      • Quality control of welding seams
      • SEM/EDX Analysis
      • X-ray fluorescence analysis (XRF)
      • X-ray inspection
      • Microsectioning and Ion beam etching
      • Ultrasonic-Microscopy (SAM)
      • Fully automated solderability test
    • Component Processing
      ▽
      • 3D lead inspection
      • Component drying
      • Tape & Reel Service
      • Marking procedures
      • Component Conditioning
      • Reballing
      • Reworking printed circuit boards
    • Research projects
    • db-creator – individual process digititalization
  • News/Events
  • HTV-Academy
  • Contact
    ▽
    • Newsletter
  • Deutsch