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News / Events / Publications » Nachrichten » SILICON SAXONY DAY 2023 | 21.06.2023, Airport Dresden
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SILICON SAXONY DAY 2023 | 21.06.2023, Airport Dresden

21. June 2023

Our colleagues  Gunter Mößinger and Eric Bremicker were on site at the 17th Silicon Saxony Day at Dresden Airport and exchanged ideas with numerous technology experts from science, research and industry. The most important industry trends were exchanged and many new contacts were made for the future.

Read more: Silicon Saxony Day 2023

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  • About us
    ▽
    • Group of companies
  • Services
    ▽
    • Test House
      ▽
      • ASIC Design and Testing
      • Testing Assemblies
      • Electrical Testing
      • MTBF Calculation
      • Testing Optical Parameters
      • Memory Qualification
      • Environmental Testing and Qualification
    • Programming
      ▽
      • Component Programming
      • OTP-Alive
    • Long-Term Conservation
      ▽
      • HTV-TAB®- Long-term conservation
      • HTV-TAB®- Long-term conservation of assemblies
      • HTV-TAB®- Long-term conservation of displays
      • HTV-TAB®- Long-term conservation of wafers & DIEs
      • HTV-TAB®- Long-term conservation in high-security buildings
      • Material changes and aging processes
      • Obsolescence management
      • Relifing of space components
      • HTV-EverStock
      • HTV-PermaDoc®
    • Material Analysis Institute
      ▽
      • Material Testing
        ▽
        • Additive Manufacturing
        • PFAS Substitute Qualification
      • Accredited test laboratory
      • Chemical component decapsulation
      • Dye & Pull Test
      • Uncovering component counterfeiting
      • Infrared Spectroscopy (FTIR)
      • Evaluating printed circuit boards
      • Light microscopy
      • MetaFinePrep®
      • Nanoindentation
      • Quality control of welding seams
      • SEM/EDX Analysis
      • X-ray fluorescence analysis (XRF)
      • X-ray inspection
      • Microsectioning and Ion beam etching
      • Ultrasonic-Microscopy (SAM)
      • Fully automated solderability test
    • Component Processing
      ▽
      • 3D lead inspection
      • Component drying
      • Tape & Reel Service
      • Marking procedures
      • Component Conditioning
      • Reballing
      • Reworking printed circuit boards
    • Research projects
    • db-creator – individual process digititalization
  • News/Events
  • HTV-Academy
  • Contact
    ▽
    • Newsletter
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